![[list:title]](/static/upload/image/20250604/1749027407125339.jpg)
![[list:title]](/static/upload/other/20250408/1744110112565852.jpeg)
![[list:title]](/static/upload/image/20250408/1744110117488945.jpg)
How Fast Does Epoxy Resin Dry? Factors T···
Epoxy Table Top for First-Timers: Tools,···
What is the Coverage Area of 1 Gallon of···
Product overview Silicon potting adhesive is a two-component, with good fluidity, fast curing rate, no corrosion, low stress after curing, high thermal conductivity characteristics, very suitable for high-power LED drive power, LED bulb, LED underwater light and spotlight...
Basic parameters
Color:
proportions:
Curing time:
Temperature resistance range:
Product TDS:
Application scope:
Product Description
Product overview
Silicon potting adhesive is a two-component, with good fluidity, fast curing rate, no corrosion, low stress after curing, high thermal conductivity characteristics, very suitable for high-power LED drive power, LED bulb, LED underwater light and spotlight drive module, as well as optical fiber, precision instruments and other thermal potting protection.
Product technical parameters
| / | Performance index | argument |
| precure | External view | White/grey/black fluid |
Viscosity of Component A (mPa•s) | 3000 ~ 3500 | |
Viscosity of Component B (mPa•s) | 2500 ~ 3000 | |
| Operating performance | Two-component mixing ratio (weight ratio) A: B | 1:1 |
Viscosity after mixing (mPa•s) | 2500 ~ 3000 | |
Operating time (min, 25℃) | 30 ~ 50 | |
Initial curing time (hr, 25℃) | 2 ~ 3 | |
| After curing | Hardness (shore A) | 40 ~ 45 |
| Tensile strength (MPa) | 2 ~ 2.5 | |
| Elongation (%) | 100 ~ 120 | |
| Coefficient of thermal expansion (μm/m-℃) | 220(30 ~ 150℃) | |
| Water absorption (%) | ≤0.06 | |
| Internal stress (MPa) | ≤0.5 | |
| Dielectric strength (kV/mm) | ≥25 | |
| Dielectric constant (1.2MHz) | ≤3.0 | |
| Volume resistivity (Ω·cm) | ≥1.0×1014 | |
| Thermal conductivity [W (m·K)] | 1.0 ~ 1.2 | |
| Flame retardant class | V-1 | |
| Operating temperature range (℃) | -50 ~ 200 |
Usage method
1. Measurement: Before mixing, components A and B need to be fully and evenly stirred using containers such as hand stirrers. It is normal for packing to settle due to long placement time. Stir well, do not affect the use.
2. Mixing: The A and B components are mixed evenly in the mixing tank, and the uneven mixing will affect the appearance and insulation performance of the cured material. (Note: The total amount of glue should not exceed 1/2 of the container each time, otherwise the glue will overflow during defoaming.)
3. Pouring: Fill the evenly mixed rubber material into the product that needs to be filled as soon as possible. In general, molding below 6mm can be naturally defoamed. However, when manually mixing, if the depth of molding is deep, bubbles or pinholes may occur on the surface and inside, so the mixture should be put into a vacuum container and defrosted at 0.06MPa for at least 5 minutes.
4. Curing: The potting parts can be cured at room temperature or heated. The higher the temperature, the faster the curing speed, we can adjust the curing time to 1-10 hours according to customer requirements.
Packing, storage and transportation and precautions
1. The packaging specifications of this product are: 400 Kg/ set, (200Kg of component A + 200Kg of component B) or 60 Kg/ set, (30Kg of component A + 30Kg of component B);
2. The product should be sealed and stored in a cool and dry place to prevent rain and sun exposure;
3. The storage period of this product is 24 months (at 25℃), and it can still be used after re-inspection.
4. When the two components of A and B are mixed, the inaccurate ratio will affect the vulcanization process and product performance, so it must be accurately measured.
5. This product is non-dangerous goods and can be transported as general chemicals.
6. Certain materials, chemicals, hardeners and plasticizers can inhibit the curing of this product, including:
organotin and other organometallic compounds
Silicone rubber with organotin catalyst
Sulfur, polysulfide, polysulfone or other sulfur-containing materials
amine, polyurethane rubber or materials containing ammonia
unsaturated hydrocarbon plasticizer
Some flux residues
If there is doubt as to whether a particular substrate or material will inhibit curing, it is recommended that a small-scale compatibility test be performed first to determine the suitability of the application. If there is liquid or uncured between the substrate in question and the cured gel interface.